inital commit

This commit is contained in:
MReenen
2022-11-22 16:35:28 +01:00
commit 0594711012
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EESchema-DOCLIB Version 2.0
#
$CMP HEF4067BT,653
D NEXPERIA - HEF4067BT,653 - ANALOGUE MUX/DEMUX, SINGLE, 16:1, SOIC24
K
F https://assets.nexperia.com/documents/data-sheet/HEF4067B.pdf
$ENDCMP
#
#End Doc Library

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EESchema-LIBRARY Version 2.3
#encoding utf-8
#SamacSys ECAD Model HEF4067BT,653
#/757416/1011235/2.49/24/2/Integrated Circuit
DEF HEF4067BT,653 IC 0 30 Y Y 1 F N
F0 "IC" 850 300 50 H V L CNN
F1 "HEF4067BT,653" 850 200 50 H V L CNN
F2 "SOIC127P1032X265-24N" 850 100 50 H I L CNN
F3 "https://assets.nexperia.com/documents/data-sheet/HEF4067B.pdf" 850 0 50 H I L CNN
F4 "NEXPERIA - HEF4067BT,653 - ANALOGUE MUX/DEMUX, SINGLE, 16:1, SOIC24" 850 -100 50 H I L CNN "Description"
F5 "2.65" 850 -200 50 H I L CNN "Height"
F6 "Nexperia" 850 -300 50 H I L CNN "Manufacturer_Name"
F7 "HEF4067BT,653" 850 -400 50 H I L CNN "Manufacturer_Part_Number"
F8 "771-HEF4067BTD-T" 850 -500 50 H I L CNN "Mouser Part Number"
F9 "https://www.mouser.co.uk/ProductDetail/Nexperia/HEF4067BT653?qs=me8TqzrmIYWsXenzFFV7pg%3D%3D" 850 -600 50 H I L CNN "Mouser Price/Stock"
F10 "HEF4067BT,653" 850 -700 50 H I L CNN "Arrow Part Number"
F11 "https://www.arrow.com/en/products/hef4067bt653/nexperia" 850 -800 50 H I L CNN "Arrow Price/Stock"
F12 "" 850 -900 50 H I L CNN "Mouser Testing Part Number"
F13 "" 850 -1000 50 H I L CNN "Mouser Testing Price/Stock"
DRAW
X Z 1 0 0 200 R 50 50 0 0 P
X Y7 2 0 -100 200 R 50 50 0 0 P
X Y6 3 0 -200 200 R 50 50 0 0 P
X Y5 4 0 -300 200 R 50 50 0 0 P
X Y4 5 0 -400 200 R 50 50 0 0 P
X Y3 6 0 -500 200 R 50 50 0 0 P
X Y2 7 0 -600 200 R 50 50 0 0 P
X Y1 8 0 -700 200 R 50 50 0 0 P
X Y0 9 0 -800 200 R 50 50 0 0 P
X A0 10 0 -900 200 R 50 50 0 0 P
X A1 11 0 -1000 200 R 50 50 0 0 P
X VSS 12 0 -1100 200 R 50 50 0 0 P
X VDD 24 1000 0 200 L 50 50 0 0 P
X Y8 23 1000 -100 200 L 50 50 0 0 P
X Y9 22 1000 -200 200 L 50 50 0 0 P
X Y10 21 1000 -300 200 L 50 50 0 0 P
X Y11 20 1000 -400 200 L 50 50 0 0 P
X Y12 19 1000 -500 200 L 50 50 0 0 P
X Y13 18 1000 -600 200 L 50 50 0 0 P
X Y14 17 1000 -700 200 L 50 50 0 0 P
X Y15 16 1000 -800 200 L 50 50 0 0 P
X ~E 15 1000 -900 200 L 50 50 0 0 P
X A2 14 1000 -1000 200 L 50 50 0 0 P
X A3 13 1000 -1100 200 L 50 50 0 0 P
P 5 0 1 6 200 100 800 100 800 -1200 200 -1200 200 100 N
ENDDRAW
ENDDEF
#
#End Library

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PCBNEW-LibModule-V1 2022-11-22 15:19:36
# encoding utf-8
Units mm
$INDEX
SOIC127P1032X265-24N
$EndINDEX
$MODULE SOIC127P1032X265-24N
Po 0 0 0 15 637ce888 00000000 ~~
Li SOIC127P1032X265-24N
Cd SOT137-1
Kw Integrated Circuit
Sc 0
At SMD
AR
Op 0 0 0
T0 0 0 1.27 1.27 0 0.254 N V 21 N "IC**"
T1 0 0 1.27 1.27 0 0.254 N I 21 N "SOIC127P1032X265-24N"
DS -5.95 -8.05 5.95 -8.05 0.05 24
DS 5.95 -8.05 5.95 8.05 0.05 24
DS 5.95 8.05 -5.95 8.05 0.05 24
DS -5.95 8.05 -5.95 -8.05 0.05 24
DS -3.7 -7.7 3.7 -7.7 0.1 24
DS 3.7 -7.7 3.7 7.7 0.1 24
DS 3.7 7.7 -3.7 7.7 0.1 24
DS -3.7 7.7 -3.7 -7.7 0.1 24
DS -3.7 -6.43 -2.43 -7.7 0.1 24
DS -3.4 -7.7 3.4 -7.7 0.2 21
DS 3.4 -7.7 3.4 7.7 0.2 21
DS 3.4 7.7 -3.4 7.7 0.2 21
DS -3.4 7.7 -3.4 -7.7 0.2 21
DS -5.7 -7.685 -3.75 -7.685 0.2 21
$PAD
Po -4.725 -6.985
Sh "1" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po -4.725 -5.715
Sh "2" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po -4.725 -4.445
Sh "3" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po -4.725 -3.175
Sh "4" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po -4.725 -1.905
Sh "5" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po -4.725 -0.635
Sh "6" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po -4.725 0.635
Sh "7" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po -4.725 1.905
Sh "8" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po -4.725 3.175
Sh "9" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po -4.725 4.445
Sh "10" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po -4.725 5.715
Sh "11" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po -4.725 6.985
Sh "12" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 6.985
Sh "13" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 5.715
Sh "14" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 4.445
Sh "15" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 3.175
Sh "16" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 1.905
Sh "17" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 0.635
Sh "18" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 -0.635
Sh "19" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 -1.905
Sh "20" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 -3.175
Sh "21" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 -4.445
Sh "22" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 -5.715
Sh "23" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$PAD
Po 4.725 -6.985
Sh "24" R 0.7 1.95 0 0 900
At SMD N 00888000
Ne 0 ""
$EndPAD
$EndMODULE SOIC127P1032X265-24N
$EndLIBRARY

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(module "SOIC127P1032X265-24N" (layer F.Cu)
(descr "SOT137-1")
(tags "Integrated Circuit")
(attr smd)
(fp_text reference IC** (at 0 0) (layer F.SilkS)
(effects (font (size 1.27 1.27) (thickness 0.254)))
)
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 1.27 1.27) (thickness 0.254)))
)
(fp_text value "SOIC127P1032X265-24N" (at 0 0) (layer F.SilkS) hide
(effects (font (size 1.27 1.27) (thickness 0.254)))
)
(fp_line (start -5.95 -8.05) (end 5.95 -8.05) (layer F.CrtYd) (width 0.05))
(fp_line (start 5.95 -8.05) (end 5.95 8.05) (layer F.CrtYd) (width 0.05))
(fp_line (start 5.95 8.05) (end -5.95 8.05) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.95 8.05) (end -5.95 -8.05) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.7 -7.7) (end 3.7 -7.7) (layer F.Fab) (width 0.1))
(fp_line (start 3.7 -7.7) (end 3.7 7.7) (layer F.Fab) (width 0.1))
(fp_line (start 3.7 7.7) (end -3.7 7.7) (layer F.Fab) (width 0.1))
(fp_line (start -3.7 7.7) (end -3.7 -7.7) (layer F.Fab) (width 0.1))
(fp_line (start -3.7 -6.43) (end -2.43 -7.7) (layer F.Fab) (width 0.1))
(fp_line (start -3.4 -7.7) (end 3.4 -7.7) (layer F.SilkS) (width 0.2))
(fp_line (start 3.4 -7.7) (end 3.4 7.7) (layer F.SilkS) (width 0.2))
(fp_line (start 3.4 7.7) (end -3.4 7.7) (layer F.SilkS) (width 0.2))
(fp_line (start -3.4 7.7) (end -3.4 -7.7) (layer F.SilkS) (width 0.2))
(fp_line (start -5.7 -7.685) (end -3.75 -7.685) (layer F.SilkS) (width 0.2))
(pad 1 smd rect (at -4.725 -6.985 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -4.725 -5.715 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -4.725 -4.445 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -4.725 -3.175 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -4.725 -1.905 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -4.725 -0.635 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -4.725 0.635 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -4.725 1.905 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -4.725 3.175 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -4.725 4.445 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -4.725 5.715 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -4.725 6.985 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 4.725 6.985 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 4.725 5.715 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 4.725 4.445 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 4.725 3.175 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 4.725 1.905 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at 4.725 0.635 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at 4.725 -0.635 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at 4.725 -1.905 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at 4.725 -3.175 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 22 smd rect (at 4.725 -4.445 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at 4.725 -5.715 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at 4.725 -6.985 90) (size 0.7 1.95) (layers F.Cu F.Paste F.Mask))
(model HEF4067BT,653.stp
(at (xyz -0.33464566929134 -0.27480315035722 -0.14803149568753))
(scale (xyz 1 1 1))
(rotate (xyz -90 0 -90))
)
)